Electronic Packaging Sensor Housing
Electronic Packaging Wirebondable
Electronic Packaging MEMs
Electronic Packaging Sensor Housing Solder Bearing

Interplex offers complete solutions from concept through development and into scalable high-volume production of electronic modules for almost any electronic packaging application. Interplex's network of engineers develop solutions that fit the manufacturing needs of our customers and then match up those needs with the best Interplex production facility.
Today, Interplex continues to expand its technologies and capabilities from developing solutions for high-speed data and micro electronic packaging requirements to high-current, thermally efficient packaging for power generation and conversion in electronic modules' applications such as RF Power and Hybrid technologies. Interplex is always driven by the singular mission to deliver innovative solutions and services to our customers.

What Type of Electronic Modules does Interplex Manufacture?

  • Sensor Housings
  • RF, Hybrid, Converters & Solar Devices
  • UV & Light Detectors
  • Power Modules
  • Tire Pressure Housings
  • Component Holders
  • Ceramic Interconnects
  • Microelectronics
  • Semiconductor Packages
Die & Wire-Bondable Electronic Packages
Steering Power Module
  • Sensor Connector Housings
  • Power Electronics
  • Temperature Sensors
  • Motor Controllers
  • Power Leadframes
  • Pressure & Vacuum
  • Wire-bondable Ag, Ni, Pd, Au, NiP Platings
  • Metal or Plastic Die Paddles
  • Reel to Reel options
  • Ductile Thermal Heat Spreaders
Semiconductor Electronic Packages
Mem's Semiconductor Package
  • MEMS
  • CPV Solar
  • Pressure & Motion
  • RF Power
  • UV Detectors
  • LED
  • Multi-Chip
  • High Power
  • Photonic
  • High Temperature LCP Plastic
  • Metal or Plastic Die Paddle
  • Reel to Reel
  • Wire-bondable
  • Copper Base Flange Technology
  • SMT, Through-Hole
Solder Bearing Interconnect Products
Vacuum Sensor
  • Microelectronics
  • Multichip Modules
  • Memory Modules
  • Ceramic Interconnects
  • Sensor Assemblies
  • Large Variety of Solder Types
  • CTE Mismatch Compliant
  • Reel to Reel for Automation
  • Zip, SIP, Zig-Zag Configurations
  • Connectors
PCB Interface, Press-Fit and Bondable Electronic Packages
Chassis Sensor
  • Position Sensors
  • Motor Drivers
  • Starters
  • Intake Manifold
  • Controllers
  • TPMS Sensors
  • Press-Fit/Compliant Technology
  • Wire-bondable Connections
  • Tuning Forks and Sockets
  • High Temp. Alloys & Plastic Options
  • High Current Options
  • I/O Connector Options
Continuous Plastic Assemblies and Component Holders
Flex Circuit Assembly
  • Bobbin Assemblies
  • Flex Circuit Assemblies
  • Pressure Sensors
  • Capacitor Holders
  • Telecom Jacks
  • Relays
  • Reel to Reel
  • SMT or Connector Interface
  • Custom & Select Plating Options
  • Metal Etched and Stamped Options
Engineering and Development
  • Application Expertise and Design Assistance
  • FEA Evaluation
  • Design Validation & Product Development
  • Design for Global Manufacturing
  • Packaging Integration
  • Production Tool Design and Build
  • Quick Turn Prototypes
Additional Resources
Micro Module Substrates
Press-Fit Interconnects
Semiconductor Packaging
Solder Bearing Leads

Additional Documents

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Electronic Packages by Interplex
Electronic Packaging Sensor Housing
Electronic Packaging Wirebondable
Electronic Packaging MEMs
Electronic Packaging Sensor Housing Solder Bearing