Interplex Introduces New Cap-LocTM System
College Point, NY – October 29, 2009. Interplex Industries, a leading global provider of precision components and assemblies, has introduced its new Cap-Loc
TM system, a product designed for mounting electrolytic capacitors onto printed circuit boards (PCBs).
Interplex’s Cap-Loc
TM system is a completely solderless electrical and mechanical mounting system for electrolytic capacitors that eliminates the secondary processes and technologies like soldering, adhesives, or clamps commonly used to make electrical and/or mechanical connections to PCB’s. This capacitor mounting system is designed to withstand the rigors of automotive applications and other mobility type products with operating temperatures up to 125° C.
The Cap-Loc
TM product is designed to accommodate 18mm diameter capacitor bodies with lengths up to 42mm. It is uniquely featured with a strong mechanical hold onto the crimp area of the capacitor but compliant enough to accommodate the large tolerances that can be found among various capacitor manufacturers. Electrically, there is 1mΩ of contact resistance between the lead and the PCB. This low resistance is achieved through use of a high 2Kg normal force solderless interconnect system. This Cap-Loc
TM system features a strain-relief design to protect the capacitor leads and utilizes Interplex’s 0.8mm press-fit interconnect technology for the PCB interconnect which is proven to withstand the high vibration environments of the automotive industry.
Founded in 1958, Interplex Industries, Inc. is headquartered in College Point, NY. The company continues to expand its technology and capabilities in the areas of product design and application development services, metal etching, prototyping, tool design and build, precision metal stamping, die casting, precision machining, plating and finishing, insert and injection molding, assembly and full scale automation services around the world. Interplex currently provides its services to the communications, electronics, industrial, medical and automotive markets and has facilities in the United States, Mexico, China, Singapore, India, Malaysia, Korea, Scotland, France, Germany and Hungary.