Press Release
Interplex Introduces New SMT Press-Fit Product
East Providence, Rhode Island – 7 February, 2012. Interplex Engineered Products, a turnkey, vertically integrated world-class supplier of stamped, plated and molded precision components and a division of Interplex Industries, Inc., has introduced a new patent-pending Surface Mount Technology (SMT) Card-Edge Connector System based on the company’s
press-fit technology.
Interplex’s new product is a discreet pick and place SMT component that creates a solderless edge card interconnection for daughter board applications. These SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection.
Joe Lynch, Interplex’s Director of Advanced Product Development commented, “We continue to expand our press-fit technology to meet the ever evolving needs of our customers. As new applications emerge, Interplex will search for new ways to solve challenging problems by eliminating unnecessary processes and providing the most robust interconnect solution.
To visit the SMT Card-Edge Contact System's product page,
click here.
The SMT Card Edge Contact System is designed for standard 1.6 mm (0.062”) thick printed circuit boards (PCB’s) but is compatible with additional PCB thicknesses. The center minimum PCB spacing is 3.2 mm (0.126”).
The product features Interplex’s proven and tested 0.64 mm press-fit technology. It is packaged in a 16 mm x 4 mm pitch EIA tape on a 13” diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. It is suitable for high-conductivity material, able to carry up to 15 amps per contact.
Founded in 1958, Interplex Industries, Inc. is headquartered in College Point, NY. The company continues to expand its technology and capabilities in the areas of product design and application development services, metal etching, prototyping, tool design and build, precision metal stamping, die casting, precision machining, plating and finishing, insert and injection molding, assembly and full scale automation services around the world. Interplex currently provides its services to the communications, electronics, industrial, medical and automotive markets and has facilities in the United States, Mexico, China, Singapore, India, Malaysia, Korea, Scotland, France, Germany and Hungary.
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