Electronic Modules and Packaging Solutions
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application. Interplex's network of engineers develop solutions that fit the manufacturing needs of our customers and then match up those needs with the best Interplex production facility.
Today, Interplex continues to expand its technologies and capabilities from developing solutions for high-speed data and micro packaging requirements to high-current, thermally efficient packaging for power generation and conversion in applications such as RF Power and Hybrid technologies. Interplex is always driven by the singular mission to deliver innovative solutions and services to our customers.
APPLICATIONS:
- Sensor Housings
- RF, Hybrid, Converters & Solar Devices
- UV & Light Detectors
- RFID & Security Tags
- Tire Pressure Housings
- Component Holders
- Ceramic Interconnects
- Microelectronics
- Semiconductor Packages
| MARKETS:
- Automotive
- Military
- Aerospace
- Industrial
- Consumer Electronics
- Medical
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Die & Wire-Bondable Electronic Packages
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- Sensor Connector Housings
- Power Electronics
- Temperature Sensors
- Motor Controllers
- Power Leadframes
- Pressure & Vacuum
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- Wire-bondable Ag, Ni, Pd, Au, NiP Platings
- Metal or Plastic Die Paddles
- Reel to Reel options
- Ductile Thermal Heat Spreaders
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Semiconductor Packages
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- MEMS
- CPV Solar
- Pressure & Motion
- RF Power
- UV Detectors
- LED
- Multi-Chip
- High Power
- Photonic
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- High Temperature LCP Plastic
- Metal or Plastic Die Paddle
- Reel to Reel
- Wire-bondable
- Copper Base Flange Technology
- SMT, Through-Hole
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Solder Bearing Interconnect Products
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- Microelectronics
- Multichip Modules
- Memory Modules
- Ceramic Interconnects
- Sensor Assemblies
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- Large Variety of Solder Types
- CTE Mismatch Compliant
- Reel to Reel for Automation
- Zip, SIP, Zig-Zag Configurations
- Connectors
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PCB Interface, Press-Fit and Bondable Packages
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- Position Sensors
- Motor Drivers
- Starters
- Intake Manifold
- Controllers
- TPMS Sensors
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- Press-Fit/Compliant Technology
- Wire-bondable Connections
- Tuning Forks and Sockets
- High Temp. Alloys & Plastic Options
- High Current Options
- I/O Connector Options
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Micro-Module Packaging Substrates
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- Security Tags
- RFID Tags
- Smart Cards
- Passports
- Bank Cards
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- Single & Double Layer
- Plated Through Holes
- Flexible & Wire-bondable
- Reeled Format
- Platings Options-Ag, Sn, NiAu, NiPdAu
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Continuous Plastic Assemblies and Component Holders
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- Bobbin Assemblies
- Flex Circuit Assemblies
- Pressure Sensors
- Capacitor Holders
- Telecom Jacks
- Relays
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- Reel to Reel
- SMT or Connector Interface
- Custom & Select Plating Options
- Metal Etched and Stamped Options
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Engineering and Development
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- Application Expertise and Design Assistance
- FEA Evaluation
- Design Validation & Product Development
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- Design for Global Manufacturing
- Packaging Integration
- Production Tool Design and Build
- Quick Turn Prototypes
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Additional Resources