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Interplex Engineered Products



Manufacturing Solutions for Product Technologies

Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic Electronic Packages across all major markets.

Expertise in Application Engineering combined with our product design and full compliment of turnkey manufacturing processes, allows IEP to offer complete solutions from concept through development and into scalable high volume production for most any packaging requirement.

Interplex Engineered Products, located in a modern 125,000 SqFt facility in East Providence RI, is part of the global network of Interplex Industries Companies. With over 25 world wide locations in 10 Countries, Interplex provides single source options with many strategic supply chain oppurtunities to insure the success of our customers in a constantly changing global marketplace.

PHOTONIC / LED Packages
Photonic Receiver
Photonic Receiver
Parallel (Multicolor) LED Package
Parallel (Multicolor) LED Package
Applications
  • Fiber Optic Receivers
  • High Power LED Mounting
  • Multi-chip-Multicolor LED Mounting
  • High Brightness LED
  • SMD or Through -Hole Package
Features
  • Thermally Efficient Dual Leadframe Technology
  • Power Dissipation levels to 8 W/Mk
  • High Reflectance LCP
  • Economical Reel to Reel Lead Frame Array
  • Low cost - Higher performance
  • Several Wire & Die Bondable Plating Options
RF POWER Packages
Two Stage LDMOS Amplifier Package
Two Stage LDMOS Amplifier Package
Single Stage LDMOS Amplifier Package
Single Stage LDMOS Amplifier Package
Applications
  • Cellular Handset
  • Cellular Infrastructure
  • RF Power Discretes
  • Military Avionics
  • RF ID tags
  • High Definition Display
Features
  • LCP Package Technology
  • Dual reel to reel lead-frame Technology
  • Thermally Efficient Pure copper base alloy
  • Power Dissipation levels up to 160 W/Mk and beyond
  • Low Dielectric Constant / Low Capacitance
  • Snap-on Lid option
  • Low cost - Higher performance
  • Several Wire & Die Bondable Plating Options
SENSOR & MEMS Packages
Automotive Pressure Sensor
Automotive Pressure Sensor
20 Pin MEMS SMD Package
20 Pin MEMS SMD Package
Applications
  • Motion sensors
  • Photovoltaic sensors
  • Automotive sensors
  • MEMS Devices
Features
  • Copper or Plastic Die paddle
  • Low Dielectric Constant
  • Reel to Reel Dual Lead frame Array
  • High Performance LCP Thermoplastic
  • Several Wire & Die Bondable Plating Options
  • SMD or Through-Hole Packages
MOTOR DRIVES & SOLDER-LESS Packages
Motor Driver Power Amplifier
Motor Driver Power Amplifier
Solder-less Automotive Module
Solder-less Automotive Module
Applications
  • Automotive & Industrial Control Modules
  • Motor Driver Assemblies
  • Brake & Steering Assist
  • Pressure Monitors
  • Intake Flapper Controls
  • Automotive Doors
  • Motor Starters
  • Engine & Transmission Controllers
  • Proximity/Positions Sensors Modules
Features
  • Solder-less Press-Fit & Tuning Fork Interconnects
  • High Performance LCP Thermoplastic Available
  • Wire Bondable Options
  • Integrated Multiple Lead Frame Arrays
  • Reel to Reel Copper Heat Sinks
  • Harness and PCB Interface Options
Address

Interplex Engineered Products
231 Ferris Avenue
East Providence, RI 02916
USA

(401) 434 6543
(508) 399 7655 (fax)

European Representative

Panda Europe
Andy Longford
Oakbury House, Mill Lane
Lambourn, Hungerford
Berkshire
RG17 8YP
United Kingdom

(44) 1488 73512
(44) 1488 73572 (fax)

Presentation
Corporate Overview & Automotive Capabilities


Other Links

Interplex Engineered Products Inquiry
IEP Product Guide
Panda Europe Web Site

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