Interplex Engineered Products

Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets.

Interplex Engineered Products (IEP) designs, develops and manufactures electronic packages, for Photovoltaic , LED , RF power, MEMS, RF ID tag and other similar semi-conductor packaging applications.

Expertise in Application Engineering combined with our product design and full compliment of turnkey manufacturing processes, allows IEP to offer complete solutions from concept through development and into scalable high volume production for most any electronic packaging requirement.

Interplex Engineered Products, located in a modern 125,000 SqFt facility in East Providence RI, is part of the global network of Interplex Industries Companies. With over 25 world wide locations in 10 Countries, Interplex provides single source options with many strategic supply chain opportunities to insure the success of our customers in a constantly changing global marketplace.

PHOTONIC / LED Packages
Photonic Receiver	Parallel (Multicolor) LED Package
Applications Fiber Optic Receivers High Power LED Mounting Multi-chip-Multicolor LED Mounting High Brightness LED SMD or Through -Hole Package	Features Thermally Efficient Dual Leadframe Technology Power Dissipation levels to 8 W/Mk High Reflectance LCP Economical Reel to Reel Lead Frame Array Low cost - Higher performance Several Wire & Die Bondable Plating Options

RF POWER Packages
Two Stage LDMOS Amplifier Package	Single Stage LDMOS Amplifier Package
Applications Cellular Handset Cellular Infrastructure RF Power Discretes Military Avionics RF ID tags High Definition Display	Features LCP Package Technology Dual reel to reel lead-frame Technology Thermally Efficient Pure copper base alloy Power Dissipation levels up to 160 W/Mk and beyond Low Dielectric Constant / Low Capacitance Snap-on Lid option Low cost - Higher performance Several Wire & Die Bondable Plating Options

SENSOR & MEMS Packages
Automotive Pressure Sensor	20 Pin MEMS SMD Package
Applications Motion sensors Photovoltaic sensors Automotive sensors MEMS Devices	Features Copper or Plastic Die paddle Low Dielectric Constant Reel to Reel Dual Lead frame Array High Performance LCP Thermoplastic Several Wire & Die Bondable Plating Options SMD or Through-Hole Packages

MOTOR DRIVES & SOLDER-LESS Packages
Motor Driver Power Amplifier	Solder-less Automotive Module
Applications Automotive & Industrial Control Modules Motor Driver Assemblies Brake & Steering Assist Pressure Monitors Intake Flapper Controls Automotive Doors Motor Starters Engine & Transmission Controllers Proximity/Positions Sensors Modules	Features Solder-less Press-Fit & Tuning Fork Interconnects High Performance LCP Thermoplastic Available Wire Bondable Options Integrated Multiple Lead Frame Arrays Reel to Reel Copper Heat Sinks Harness and PCB Interface Options

Address

Interplex Engineered Products
231 Ferris Avenue
East Providence, RI 02916
USA

(401) 434 6543
(508) 399 7655 (fax)

Panda Europe
Andy Longford
Oakbury House, Mill Lane
Lambourn, Hungerford
Berkshire
RG17 8YP
United Kingdom

(44) 1488 73512
(44) 1488 73572 (fax)

	Presentation
	Corporate Overview & Automotive Capabilities

	Interplex Engineered Products Inquiry
	IEP Product Guide
	IEP Press-Fit Solutions
	Panda Europe Web Site