Press Release
Interplex NAS Introduces New Solder and Flux Bearing Lead Component
Northvale, NJ – 24 June, 2010. Interplex NAS, a world-class supplier of precision components and assemblies and a division of Interplex Industries, Inc., announced today that it has introduced a new addition to its revolutionary line of solder and flux-bearing lead products. The new surface mount pin, a short-current path lead, offers customers a number of unique advantages in the circuit assembly process.
The lead (Product Code 34AC) possesses a pitch of 2.54 mm with a low-profile design for surface mount applications in restricted places. Its short current path is ideal for high-frequency electronic applications. Manufactured from a nickel-iron alloy and post-plated with a 60/40 tin/lead bright finish over nickel, the component can be configured for dual inline and quad packages.
Interplex NAS’s patented solder and flux bearing leads are the world’s most reliable solution for assembling hybrid and PCB circuits. Interplex NAS leads contain a flux-cored solder preform that creates consistent high-quality solder joints, quickly and economically. They permit a unique one-step assembly and reflow operation that consistently produces 100% solderability, thereby eliminating the need for costly inspection and rework. Customers report that Interplex NAS solder and flux leads allow them to significantly reduce circuit assembly processing costs while improving product reliability.
Founded in 1958, Interplex Industries, Inc. is headquartered in College Point, NY. The company continues to expand its technology and capabilities in the areas of product design and application development services, metal etching, prototyping, tool design and build, precision metal stamping, die casting, precision machining, plating and finishing, insert and injection molding, assembly and full scale automation services around the world. Interplex currently provides its services to the communications, electronics, industrial, medical and automotive markets and has facilities in the United States, Mexico, China, Singapore, India, Malaysia, Korea, Scotland, France, Germany and Hungary.
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