Press Release
Interplex Expands Wire-Bondable Plating Technology
College Point, NY USA – June 3, 2009. Interplex Industries, Inc., a leading provider of electromechanical components and assemblies, announced today that it has expanded its wire-bondable plating capabilities and capacity in multiple locations around the world.
In
Hangzhou, China and
Vorey sur Arzon, France, Interplex has added wire-bondable nickel phosphorus plating to complement the wire-bondable gold plating capabilities that already exist in those facilities. In addition, Interplex also provides wire-bondable nickel phosphorus and palladium plating services from its Arbroath, Scotland facility, and wire-bondable nickel phosphorus, gold, palladium and silver plating services from its
East Providence, Rhode Island facility.
Wire-bondable plating is a key process step in the manufacturing of all types of
semiconductor packages including Integrated Connector Package Modules such as MEMS housings, sensors, LEDs, and Solar and Power Electronic modules. Successful bonding of aluminum or gold wire, depending on the application, to an interconnect module lead-frame requires a plated surface with the highest level of material surface quality. Interplex is one of the few companies in the world to achieve this as part of an integrated packaging solution.
“Despite the current global economic challenges, Interplex continues to invest in technologies that allow us to offer our customers state-of-the-art manufacturing solutions,” said Jack Seidler, Interplex’s President and CEO. “By expanding our wire-bondable plating technology in the US, Europe and Asia, we can now offer customers an in-house, fully integrated module manufacturing solution, including stamping, etching, plating and molding, from North America, Europe and Asia.”
Interplex delivers application-specific open-cavity thermoplastic semiconductor and electronic packages across all major markets. Currently, Interplex’s wire-bondable plating technology includes gold, palladium and nickel phosphorus finishes.
Founded in 1958 Interplex Industries, Inc. is headquartered in College Point, NY. The company continues to expand its technology and capabilities in the areas of product design and application development services, metal etching, prototyping, tool design and build, precision metal stamping, die casting, precision machining, plating and finishing, insert and injection molding, assembly and full scale automation services around the world. Interplex currently provides its services to the communications, electronics, industrial, medical and automotive markets and has facilities in the United States, Mexico, China, Singapore, India, Malaysia, Korea, Scotland, France, Germany and Hungary.