Insert Molding
Interplex's insert molding capabilities include reel-to-reel, rotary and shuttle insert molding. These molding capabilities produce a diverse portfolio of products including, semi-conductor packages, automotive sensors, medical components, electrical connectors, hybrid invertors, power driver assemblies and many other type of molded sub assemblies.
Interplex’s design and manufacturing expertise in insert molded assemblies along with its application expertise in electronic packaging and connector technology allows Interplex to develop, design and deploy turnkey solutions to customer’s electronic packaging needs on a world wide basis. Interplex develops electronic packaging solutions in applications for Micro-Modules found in Smart cards & RFID tag, Semi-Conductors applications like LEDs, MEMs and RF Power, Wire bondable connector packages for temperature , motion, pressure sensors and Connector assemblies.
Interplex maintains a robust internal insert molding tooling and design capability to assure all tools exceed customer requirements. For mold and part design, Interplex employs top CAD packages such as AutoCAD, and Cadkey, as well 3D packages such as Pro E and Solidworks. Each facility has surface grinding, programmable CNC centers, sinker EDM and wire cutting EDM technologies, in house.
Interplex has deployed a wide array of Insert Molding presses worldwide including:
Nissei, Arburg, Battenfeld, Autojector, Newbury, Techmire, Dassert, Engel
Each Interplex facility that performs insert molding also performs precision metal stamping. As a result, Interplex provides these services to customers in a vertically integrated environment, reducing total acquisition costs and improving quality by eliminating the opportunity for defects between processes.