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Manufacturing Solutions for Product Technologies

Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semiconductor and Electronic Packages across all major markets.

IEP designs, develops and manufactures electronic packages, for Photovoltaic , LED , RF power, MEMS, RF ID tag and other similar semi-conductor packaging applications.

Expertise in Application Engineering combined with our product design and full complement of turnkey manufacturing processes, allows IEP to offer complete solutions from concept through development and into scalable high volume production for most any electronic packaging requirement.

IEP is located in a modern 125,000 SqFt facility in East Providence RI, and is part of the global network of Interplex Industries Companies. With over 25 world wide locations in 10 Countries, Interplex provides single source options with many strategic supply chain opportunities to insure the success of our customers in a constantly changing global marketplace.

PHOTONIC / LED Packages
Photonic Receiver
Photonic Receiver
Parallel (Multicolor) LED Package
Parallel (Multicolor) LED Package
Applications
  • Fiber Optic Receivers
  • High Power LED Mounting
  • Multi-chip-Multicolor LED Mounting
  • High Brightness LED
  • SMD or Through -Hole Package
Features
  • Thermally Efficient Dual Leadframe Technology
  • Power Dissipation levels to 8 W/Mk
  • High Reflectance LCP
  • Economical Reel to Reel Lead Frame Array
  • Low cost - Higher performance
  • Several Wire & Die Bondable Plating Options
RF POWER Packages
Two Stage LDMOS Amplifier Package
Two Stage LDMOS Amplifier Package
Single Stage LDMOS Amplifier Package
Single Stage LDMOS Amplifier Package
Applications
  • Cellular Handset
  • Cellular Infrastructure
  • RF Power Discretes
  • Military Avionics
  • RF ID tags
  • High Definition Display
Features
  • LCP Package Technology
  • Dual reel to reel lead-frame Technology
  • Thermally Efficient Pure copper base alloy
  • Power Dissipation levels up to 160 W/Mk and beyond
  • Low Dielectric Constant / Low Capacitance
  • Snap-on Lid option
  • Low cost - Higher performance
  • Several Wire & Die Bondable Plating Options
SENSOR & MEMS Packages
Automotive Pressure Sensor
Automotive Pressure Sensor
20 Pin MEMS SMD Package
20 Pin MEMS SMD Package
Applications
  • Motion sensors
  • Photovoltaic sensors
  • Automotive sensors
  • MEMS Devices
Features
  • Copper or Plastic Die paddle
  • Low Dielectric Constant
  • Reel to Reel Dual Lead frame Array
  • High Performance LCP Thermoplastic
  • Several Wire & Die Bondable Plating Options
  • SMD or Through-Hole Packages
MOTOR DRIVES & SOLDER-LESS Packages
Motor Driver Power Amplifier
Motor Driver Power Amplifier
Solder-less Automotive Module
Solder-less Automotive Module
Applications
  • Automotive & Industrial Control Modules
  • Motor Driver Assemblies
  • Brake & Steering Assist
  • Pressure Monitors
  • Intake Flapper Controls
  • Automotive Doors
  • Motor Starters
  • Engine & Transmission Controllers
  • Proximity/Positions Sensors Modules
Features