Interplex Electronics Malaysia provides precision metal stamping and insert molding solutions, specializing in lead-frame and packaging applications for the automotive, computer, connector, semiconductor, sensor, alternative energy and telecommunications markets. The company also supplies RF and EMI Shields, as well as components for High-Speed Connectors and Sensors.


Metal Stamping:  Die design, manufacture and run of high speed progressive dies for low to high volume applications.

Insert Molding:  Insert molding of engineered plastic onto stamped and plated components. The company possesses the ability to automatically feed multi-strand product in a reel-to-reel continuous process through high cavity precision Molds.

Tape and Reel Packaging:  In-house tape and reel packaging.
Interplex Electronics Malaysia
Lot 72 & 73, Jalan Bunga Raya,
Parit Buntar Industrial Estate,
34200 Parit Buntar,
Perak Darul Ridzuan, Malaysia

Tel: +(605) 716 9550
Fax: +(605) 716 9557

Other Links
Interplex Southeast Asia Fact Sheet
Interplex Malaysia Inquiry