Interplex Microtech Standard Specifications

	Single Sided	Double Single Sided	Double Sided Plated Through Holes
Width	35 mm / 70 mm	35 mm / 70 mm	35 mm / 70 mm
Dialetric Raw Material	FR4 100 µm	FR4 100 µm	FR4 75 µm FR4 100 µm
Copper Thickness	30 µm / 50 µm	30 µm / 50 µm	17 µm / 25 µm
Plating	Nickel HRC3 - Gold wire bonding - Contact Gold - Palladium	Nickel HRC3 - Gold wire bonding - Contact Gold - Palladium	Nickel HRC3 - Gold wire bonding - Contact Gold - Palladium
Applications	Contact	Dual Interface	Dual Interface high technology

Our open tools are available for your single side technology :

Interplex Microtech’s 6 pins open tool :	Interplex Microtech’s 8 pins open tool: