NAS INTRODUCES NEW HIGH CURRENT CAPACITY SOLDER AND FLUX BEARING LEAD

FLUSHING, NY - INTERPLEX NAS announces an addition to its revolutionary line of solder and flux bearing leads featuring a new design that offers a number of unique advantages in circuits assembly.

The new lead (product code #25CX), designed for single inline packages and surface mount applications, is manufactured at a sturdy .017" thickness that permits greater current carrying capability. Its unique compliant shape also provides stress relief for thermal expansion.

NAS patented solder and flux bearing leads are the world's most reliable solution for assembling hybrid and PCB circuits. NAS leads contain a flux-cored solder preform that creates consistent high-quality solder joints, quickly and economically. While other soldering methods yield high rates of rejects, NAS leads permit a unique one-step assembly and reflow operation that consistently produces 100% solderability -- eliminating the need for costly inspection and rework. Customers report that NAS solder and flux bearing leads allow them to significantly reduce circuits assembly processing costs while improving product reliability.

NAS can supply its leads with any solder alloy necessary to meet customers' reflow temperature requirements. Various fluxes, including no-clean, are also available. NAS also offers several types of lead assembly machines for use with its leads. These range from a simple, manual unit to complete semi-automatic lead insertion with localized hot-bar reflow.

NAS's full product line includes solder and flux bearing leads and lead attachment machines suitable for through-hole and surface mounting of single inline package, dual inline package, dual-row, zigzag inline package and MCM circuits. Conversion to NAS leads is fast and easy, requiring no significant capital investment or specialized labor skills. For complete details, contact INTERPLEX NAS, 120-12 28th Avenue, Flushing, NY 11354; phone: (718) 961-6757; fax: (718) 539-9115; or click on request information above.