Material Selection for Hybrid and Chip Carrier Chips
The evolution of hybrid and chip carrier technology has created the need for an effective interconnection scheme. The solution that has been developed is the edge clip. However, there is a wide variety of edge clips available today. I addition to both solder and non-solder bearing types, the designs available are as varied as the devices they can be applied to. Also, a wide range of materials are used to manufacture edge clips. All of this has led to confusion as to the best clip / material combination to use in a specific application.
Three basic factors which affect material selection are:
- Mechanical
- Electrical
- Thermal
The types of materials commonly used are:
- Coppers
- Beryllium copper
- Brasses
- Bronzes
- Phosphor bronze
- Leadframe materials (Kovar and F42 A alloy)
Interplex NAS can provide you with a complete report that details these peel/shear tests and reviews the key factors in material selection. Please contact us for a copy.