Solder and Flux Types
CODE |
ALLOY |
FLUX TYPE | MELTING TEMPERATURE |
Solidus (F) | Solidus (C) | Liquidus (F) | Liquidus (C) |
A |
Sn60 Pb40 | SOLID NO FLUX |
361 |
183 |
370 |
188 |
B | NO CLEAN |
C | RMA MILD ACTIVE |
D | WATER SOLUBLE |
E |
Sn10 Pb90 | SOLID NO FLUX |
514 |
268 |
576 |
302 |
F | NO CLEAN |
G | RMA MILD ACTIVE |
H | WATER SOLUBLE |
I |
Sn62 Pb36 Ag2 | SOLID NO FLUX |
354 |
179 |
354 |
179 |
J | NO CLEAN |
K | RMA MILD ACTIVE |
L | WATER SOLUBLE |
M |
Sn96 Ag4 | SOLID NO FLUX |
430 |
221 |
430 |
221 |
N | NO CLEAN |
W | RMA MILD ACTIVE |
P | WATER SOLUBLE |
Q |
Sn10 Pb88 Ag2 | SOLID NO FLUX |
514 |
268 |
576 |
302 |
R | NO CLEAN |
S | RMA MILD ACTIVE |
T | WATER SOLUBLE |
U |
Sn63 Pb37 | SOLID NO FLUX |
361 |
183 |
361 |
183 |
*V | NO CLEAN |
Y | RMA MILD ACTIVE |
Z | WATER SOLUBLE |
* Standard solder and flux
REFLOW METHODS
Some of the suggested reflow methods are:
- Hot Bar
- Thermode
- Laser
- Hot Air
- Hot Gas
- Infared
- Vapor Phase
SELECTIVE PLATING CAPABILITY
Our unique design allows us to change efficiently from control depth plating to selective area plating without costly changeover times. We offer our customers a variety of quality plated finishes, including gold, silver, palladium, nickel, bright nickel, tin, bright tin, tin/lead and copper.