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Next Generation High Density SMT Solderless Edge Card Connector System
During recent years, the evolution of PCB-to-PCB interconnection requirements between daughter boards and mother-boards has driven the growing usage of SMT Card-Edge solutions employing solderless “eye-of-the-needle” press-fit technology.

In most cases, the main PCB or mother-board is a densely populated, mixed-technology SMT board representing the bulk of the material and assembly cost within multiple board product designs. Various daughter-boards are then used to integrate special functions or to provide configuration flexibility, such as LED status indicators, power conversion and memory arrays.

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Press-Fit Technology Supplier Best-Practices - Part 1 - Design, Testing & Documentation


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SMT Card-Edge Solutions Using Solderfree Press-Fit Technology - Part 1


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Press-Fit Current Carrying Capacity - Part 2


Press-Fit Current Carrying Capacity - Part 3


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Mechanical Force Analysis for Press Fit Applications


PTH Integrity with Cross Section Analysis


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PCB Hole Construction and Material Requirements for use with Press-Fit Technologies


Additional Press-Fit Documentation


Press-Fit Current Carrying Capacity Data


Press-Fit Application Notes


Automotive Press-Fit Brochure - English


Automotive Press-Fit Brochure - French


Automotive Press-Fit Brochure - German


Automotive Press-Fit Brochure - Chinese


Solderless Press-Fit Terminals for Automotive Applications


Cap-Loc Solderless Capacitor Holder


Adapting Press-Fit Technology - White Paper


Adapting Press-Fit Technology - Presentation