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New Solder Ball Technology Provides Enhanced Co-planarity Compensation for Module and Mezzanine Applications

Advanced solder ball technologies for board-to-board applications enable manufacturers to overcome co-planarity mismatch issues and also enables module suppliers to deliver products with excellent solderability across a wider process window

Topics addressed in this Tech Bulletin include:

  • Co-planarity challenges in board-to-board applications
  • Solder Ball Technology overview
  • Leveraging Automation Processes
  • Module Manufacturing and Final Assembly

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