CODE

ALLOY

FLUX TYPE
MELTING TEMPERATURE
Solidus (F)
Solidus (C)
Liquidus (F)
Liquidus (C)
A


Sn60 Pb40
SOLID NO FLUX

361


183


370


188
B
NO CLEAN
C
RMA MILD ACTIVE
D
WATER SOLUBLE
E


Sn10 Pb90
SOLID NO FLUX

514


268


576


302
F
NO CLEAN
G
RMA MILD ACTIVE
H
WATER SOLUBLE
I


Sn62 Pb36 Ag2
SOLID NO FLUX

354


179


354


179
J
NO CLEAN
K
RMA MILD ACTIVE
L
WATER SOLUBLE
M


Sn96 Ag4
SOLID NO FLUX

430


221


430


221
N
NO CLEAN
W
RMA MILD ACTIVE
P
WATER SOLUBLE
Q


Sn10 Pb88 Ag2
SOLID NO FLUX

514


268


576


302
R
NO CLEAN
S
RMA MILD ACTIVE
T
WATER SOLUBLE
U


Sn63 Pb37
SOLID NO FLUX

361


183


361


183
*V
NO CLEAN
Y
RMA MILD ACTIVE
Z
WATER SOLUBLE
* Standard solder and flux


REFLOW METHODS
Some of the suggested reflow methods are:
  • Hot Bar
  • Thermode
  • Laser
  • Hot Air
  • Hot Gas
  • Infared
  • Vapor Phase

SELECTIVE PLATING CAPABILITY
Our unique design allows us to change efficiently from control depth plating to selective area plating without costly changeover times. We offer our customers a variety of quality plated finishes, including gold, silver, palladium, nickel, bright nickel, tin, bright tin, tin/lead and copper.